Hello-FPGA-VU13P-PCIe16 FPGA Development Board
· Process: 16nm FinFET
· High-Speed Interfaces: PCIe 3.0 X16, FMC+, FMC HPC, OCULINK
· Onboard Memory: 4GB DDR4 + 2×1Gbit QSPI Flash
· Design Feature: Industrial-grade wide-temperature design
· Target Scenarios: High-performance computing, AI inference, 5G communication, data center acceleration, etc.
Hello-FPGA-VU13P-PCIe16 FPGA Development Board
High-Performance Virtex UltraScale+ Industrial Platform for AI Inference, 5G & Data Center
Document Download
Hello-FPGA-VU13P-PCIe16 User Manual.pdfDetailed Parameters
Four Core Advantages
Top-Grade FPGA Computing Power
Equipped with AMD XCVU13P-2FHGB2104I (16nm FinFET), featuring 3,780K logic cells, 12,288 DSP slices, and 76×28.21Gbps GTY transceivers for AI/High-Speed Signal Processing.
Multi-Protocol High-Speed Interconnect
PCIe 3.0 X16, 1×Gigabit Ethernet, 2×OCULINK for SSD/Network/High-Speed Data Transmission.
Flexible Expansion
1×FMC+ + 1×FMC HPC, plus USB UART, JTAG, LEDs, buttons, and DIP switches for debug & extension.
Large Onboard Memory
4GB DDR4 onboard + max 32GB SODIMM, 2×1Gbit QSPI Flash for firmware & storage.
Product Overview
The Hello-FPGA-VU13P-PCIe16 is an industrial-grade Virtex UltraScale+ FPGA platform based on AMD XCVU13P-2FHGB2104I, designed for HPC, AI inference, 5G, and high-speed data exchange.
16nm FinFET, 3,780K logic cells, 12,288 DSPs, rich high-speed I/Os; PCIe 3.0 X16, FMC+/FMC HPC, OCULINK, Gigabit Ethernet, USB UART, JTAG.
Key Features
- Core FPGA: AMD XCVU13P-2FHGB2104I (16nm, Industrial)
- Logic Cells: 3,780K
- DSP Slices: 12,288
- GTY Transceivers: 76×28.21Gbps
- Clocks: 3×200MHz differential oscillators
- Onboard DDR4: 4GB, 2400Mbps
- DDR4 Expansion: SODIMM, max 32GB
- QSPI Flash: 2×1Gbit
- Operating Temp: -40℃ ~ +100℃
Technical Specifications
| Item | Specification |
|---|---|
| Core FPGA | AMD XCVU13P-2FHGB2104I (16nm) |
| Logic Cells | 3,780K |
| DSP Slices | 12,288 |
| GTY Transceivers | 76×28.21Gbps |
| Clocks | 3×200MHz differential |
| Onboard DDR4 | 4GB, 2400Mbps |
| DDR4 Expansion | SODIMM, max 32GB |
| QSPI Flash | 2×1Gbit |
| PCIe | PCIe 3.0 X16 |
| Operating Temp | -40℃ ~ +100℃ |
Interface Diagram
- Top: PCIe3.0 X16, Power, LEDs
- Right: FMC+, FMC HPC, 2×OCULINK
- Bottom: Gigabit Ethernet, USB UART, JTAG, Buttons, DIP, LEDs
Mechanical Dimensions
Power & Package List
| Power | Spec |
|---|---|
| Input Voltage | +12V DC |
| Max Current | 5A, over-current protected |
| Package | Qty |
|---|---|
| Development Board | 1 |
| 12V/5A Adapter | 1 |
| USB Cable | 1 |
| JTAG Cable | 1 |
| ESD Bag + Case | 1 |
| User Manual | 1 |
Safety Warning
- Do NOT hot-swap to avoid short/ESD damage.
- Always use ESD protection before handling.
- Only use the 12V/5A adapter provided.
- Verify pinout before connecting peripherals.
- Avoid high humidity, dust, and long-term high load.
Quick Start
- Check package completeness.
- Handle with ESD protection.
- Connect 12V power, verify LED.
- USB to PC, install driver.
- JTAG + Vivado setup.
- Download or flash firmware to QSPI.
- Connect peripherals and develop.
Typical Applications
AI Inference Acceleration
5G Baseband Processing
Data Center Acceleration
Video/Image Processing
Industrial Automation
Semiconductor Testing
